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CERAMIC CHIP INDUCTORS
1. PART NO. EXPRESSION :
C3 SERIES
C3-1N5S-10
(a) (b) (c) (d)
(a) Series code (b) Inductance code : 1N5 = 1.5nH
(d) 10 : Lead Free
(c) Tolerance code : S = 0.3nH, J = 5%, K = 10%, M = 20%
2. CONFIGURATION & DIMENSIONS :
A D L G
B
C
PCB Pattern Unit:m/m
A
B
C
D
G 1.00 Ref.
H 1.00 Ref.
H
L 3.00 Ref.
2.000.20 1.250.20 0.850.20 1.250.20 0.500.30
3. SCHEMATIC :
4. MATERIALS : b a
Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.)
(a) Body : Ferrite (b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION : a) Temp. rise : 30C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55C to +125C d) Operating temp. : -40C to +85C e) Resistance to solder heat : 260C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 1
CERAMIC CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS :
Part Number C3-1N5S-10 C3-1N8S-10 C3-2N2S-10 C3-2N7S-10 C3-3N3 -10 C3-3N9 -10 C3-4N7 -10 C3-5N6 -10 C3-6N8 -10 C3-8N2 -10 C3-10N -10 C3-12N -10 C3-15N -10 C3-18N -10 C3-22N -10 C3-27N -10 C3-33N -10 C3-39N -10 C3-47N -10 C3-56N -10 C3-68N -10 C3-82N -10 C3-R10 -10 C3-R12 -10 C3-R15 -10 C3-R18 -10 C3-R22 -10 C3-R27 -10 C3-R33 -10 C3-R39 -10 C3-R47 -10 Tolerance code : : S : 0.3nH J : 5% K : 10% M : 20% EIA Size 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 Dim. C ( mm ) 0.2 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 Inductance ( nH ) 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 27.0 33.0 39.0 47.0 56.0 68.0 82.0 100.0 120.0 150.0 180.0 220.0 270.0 330.0 390.0 470.0 Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50 50 Q Min. 10 10 10 12 12 12 12 15 15 15 15 15 15 15 18 18 18 18 18 18 18 18 18 13 13 13 12 12 12 10 10 Q @ 100MHz Nom. 21 18 18 19 16 18 18 20 20 21 20 21 22 24 23 23 24 23 23 23 25 24 23 22 22 23 20 20 22 17 17 DCR () Max. 0.10 0.10 0.10 0.10 0.13 0.15 0.20 0.23 0.25 0.28 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.90 0.90 0.95 1.00 1.10 1.20 1.30 1.40 1.30 1.50
C3 SERIES
Rated Current ( mA ) Max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300
SRF ( MHz ) Min. 4000 4000 4000 4000 4000 4000 3500 3200 2800 2400 2100 1900 1600 1500 1400 1300 1200 1000 900 800 700 600 600 500 500 400 350 300 250 250 200
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 2
CERAMIC CHIP INDUCTORS
7. IMPEDANCE VS. FREQUENCY CURVES :
C3 SERIES
10000
ImpedanceZ vsFrequency HCI2012 vs. Freq.
IMPEDANCE(Ohm )
1000
100
22n
82n 47n
10
10n
6n8
1 10 100 1000 10000
FREQUENCY(MHz)
1000
Inductance vs Freq. HCI2012 L vs. Frequency
INDUTANCE(nH)
100
82n 33n 47n
22n
10n 6n8
10
1 10 100 1000 10000
FREQUENCY(MHz)
1000
HCI2012 Q vs Freq.
Q vs. Frequency
100
Q
10
6n8 10n 82n
22n
1 10 100
47n
1000 10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 3
CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C3 SERIES
ITEM
Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Solder Heat Resistance
PERFORMANCE
TEST CONDITION
HP4291A, HP4287A+16092A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec.
Refer to standard electrical characteristics list
30C max. ( t) No mechanical damage Remaining terminal electrode : 70% min.
Preheating Dipping 260C 150C Natural cooling
60 seconds
100.5 seconds
Solderability
More than 90% of the terminal electrode should be covered with solder.
Preheating Dipping 245C 150C Natural cooling
Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2455C Flux for lead free : rosin Dip Time : 41sec.
60 seconds
41.0 seconds
Terminal Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
For C Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec)
W
W
7 8
Flexture Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
20(.787) Bending 45(1.772) 45(1.772) 40(1.575)
Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 4
CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C3 SERIES
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces applied on the right condition.
R0.5(0.02) 1.0(0.039)
TEST CONDITION
Series name 2 3 4 5 6 7 8 mm (inches) 0.80 (0.033) 1.40 (0.055) 2.00 (0.079) 2.70 (0.106) P-Kgf 0.3 1.0 2.5 2.5
Chip A
Random Vibration Test
Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed.
Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). No mechanical damage Temperature : 855C Applied Current : rated current Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 602C Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs.
Drop Loading at High Temperature
Drop 10 times on a concrete floor from a height of 75cm. Appearance : No damage. Inductance : Within 10% of initial value. Q : Within 20% of initial value.
Humidity
Thermal Shock
Appearance : No damage. Inductance : Within 10% of initial value. Q : Within 20% of initial value. Phase 1 2 Temperature (C) -402C +855C Times (min.) 303 303
For C Series : Condition for 1 cycle Step1 : -402C 303 min. Step2 : +855C 303 min. Number of cycles : 100 Measured at room temperature after placing for 2 to 3hrs. Temperature : -552C Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs. No mechanical damage
Low temperature storage test
Measured : 100 times
Drop
Drop 10 times on a concrete floor from a height of 75cm.
Derating Curve
Derated Current(A)
Derating
6 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A
For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve.
85
125
Operating Tem perature(C) Operating Temperature(X ) C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
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PG. 5
CERAMIC CHIP INDUCTORS
9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern
3.00 1.00
C3 SERIES
9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip
Preheating Soldering
20~40s TP(260C/10s max.) 217 200 150 60~180s 480s max. 25 60~150s
1.00
PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
TEMPERATURE C
TEMPERATURE C
Natural cooling
Preheating
260 245 150
Soldering
Natural cooling
Time(sec.) Figure 1. Re-flow Soldering
Over 2min.
Gradual Cooling Within 3s
Preheating
Soldering
3s (max.) 10s (max.)
TEMPERATURE C
Natural cooling
Figure 2. Wave Soldering
350 330 150
Over 1min.
Gradual Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 6
CERAMIC CHIP INDUCTORS
C3 SERIES
9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit Recommendable
t
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 7
CERAMIC CHIP INDUCTORS
10. PACKAGING INFORMATION : 10-1. Reel Dimension
A
C3 SERIES
Type 7" x 8mm
D B C
A(mm) 9.00.5
B(mm) 60.02.0 60.02.0
C(mm)
D(mm)
13.50.5 178.02.0 13.50.5 178.02.0
7" x 12mm 13.50.5
20.5
13.50.5 R10.5
7" x 8mm
7" x 12mm
R1.9
R0.5
120
10-2 Tape Dimension / 8mm Material : Paper
P2:20.1 E:1.750.1 Po:40.1 D:1.56 +0.1 -0.05 t
Series
Size 1
Bo(mm) 1.120.03 1.850.05 2.300.05
Ao(mm) 0.620.03 1.050.05 1.500.05
Ko(mm) 0.600.03 0.950.05 0.950.05
P(mm) 2.00.1 4.00.1 4.00.1
t(mm) 0.600.03 0.950.05 0.950.05
D1(mm) none none none
F:3.50.1
W:8.00.1
Bo
Z/L/C
2 3(09)
P
Ao
Ko
Material : Plastic
P2:20.05 E:1.750.1 Po:40.1 D:1.5+0.1 A W:8.00.1 t
Series
Size 2 3(09)
Bo(mm) 1.950.10 2.250.10 2.350.10 3.500.10 3.420.10
Ao(mm) 1.050.10 1.420.10 1.500.10 1.880.10 2.770.10
Ko(mm) 1.050.10 1.040.10 1.450.10 1.270.10 1.550.10
P(mm) 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1
t(mm) 0.230.05 0.220.05 0.220.05 0.220.05 0.220.05
D1(mm) none 1.00.1 1.00.1 1.00.1 1.00.1
F:3.50.05
Bo
Z/L/C
3(12) 4 5
P
A D1:10.1
Ao
Ko
Section A-A
10-2.1 Tape Dimension / 12mm
D:1.5+0.1 E:1.750.1 A W:12.00.1 Po:40.1 P2:20.05 t
Series
Size 6
Bo(mm) 4.950.1 4.950.1 6.100.1
Ao(mm) 1.930.1 3.660.1 5.400.1
Ko(mm) 1.930.1 1.850.1 2.000.1
P(mm) 4.00.1 8.00.1 8.00.1
t(mm) 0.240.05 0.240.05 0.300.05
D1(mm) 1.50.1 1.50.1 1.50.1
F:5.50.05
Bo
Z/L
7 8
A D1:1.50.1
P
Ao
Ko
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
CERAMIC CHIP INDUCTORS
C3 SERIES
10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000
10-4. Tearing Off Force F 165 to 180 Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300
Base tape
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9

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